AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300. GENERAL PROPERTIES Appearance Amber Cure Type Heat cure Benefits Low viscosity Easily mixed Effective electrical insulator Low permeability to gases and vapors Mix Ratio by weight 100:100 / Resin:Hardener Operating Temperature -60 to 145 °C Typical Applications FDA Grade Applications, food packaging, indirect contact with food and medical applications UNCURED PROPERTIES: Viscosity At 25 °C 1,500 (After Mixing) Thixotropic Index 1.0 Specific Gravity, mixed 1.11 Reactive solids contents, % 100 Pot Life 45 minutes CURE SCHEDULE: 4 hours At 65°C 24 hours At 25°C CURED PROPERTIES: Hardness, Shore D 65 Dielectric strength volts/mil 410 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages.
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